Silicon carbide (SiC) is increasingly used in semiconductor manufacturing equipment and space optical systems due to its high stiffness, thermal stability, and chemical resistance. However, conventional manufacturing of SiC components often relies on complex machining and long processing cycles, which limit design flexibility and scalability. This presentation introduces an additive manufacturing approach for producing advanced SiC components using binder jetting technology. Based on a SiC-dedicated binder jetting system developed in-house, the process integrates the full workflow from design for additive manufacturing (DfAM) to printing and post-processing. By separating shape formation from densification, binder jetting enables the fabrication of complex geometries, lightweight structures, and internal features that are difficult to achieve using conventional processes. Depending on the target application, different densification routes such as reaction-bonded SiC (RBSC) and CVI-based recrystallized SiC (RSiC) can be applied. Application examples related to semiconductor process components and space optical structures will be presented to demonstrate the potential of binder jetting for scalable manufacturing of high-performance SiC components.
