Founder and CEO
Kupros, Inc.
Ian Ramsdell is the Founder and CEO of Kupros, Inc., a service-disabled veteran-owned company pioneering Additive Manufactured Electronics with Cu29, the world’s first all-metal conductive filament for FDM and FFF 3D printers.
A U.S. Navy veteran with over 15 years of service, Ian launched Kupros in 2021 through the NSIN Foundry program to address the high cost and limited capability of existing AME technologies. Under his leadership, Kupros has advanced Cu29 from early-stage development to TRL 6, with customers and collaborators including NASA, Boeing, Northrop Grumman, KBR, the U.S. Army, Los Alamos National Laboratory, Youngstown State University, and Johns Hopkins APL.
Ian is currently leading Kupros’ SCMC Catalyst project, focused on the design, printing, and validation of embedded electronic components produced on commercial off-the-shelf FDM printers. This work includes fanout circuitry, SMT-standard patterns, inductors, thermistors, antennas, and radiation and EMI shielding, demonstrating that aerospace- and defense-grade electronics can be manufactured on low-cost platforms without post-processing.
Through veteran leadership and deep-tech execution, Ian is positioning Kupros as a critical supplier for next-generation defense and aerospace systems.
Disclosure information not submitted.
Cu29-EMBED: A.M. of Embedded Electronics for Space and Defense
Tuesday, April 14, 2026
3:10 PM - 3:40 PM East Coast USA Time
Wednesday, April 15, 2026
12:00 PM - 2:00 PM East Coast USA Time